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Call for Regular Papers

Download the Call for Papers in PDF version here.

The areas of interest include (but are not limited to) the following topics:

  • Analog Test
  • ATE Hardware and Software
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Current-Based Test
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DfT)
  • Design for Manufacturing (DfM)
  • Diagnosis and Silicon Debug
  • Economics of Test
  • Emerging Technologies
  • Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • GPU Test
  • High-Speed I/O Test
  • Low-Power IC Test
  • Memory Test and Repair
  • MEMS Test
  • Microprocessor Test
  • Mixed-Signal Test
  • Multi-/Many-core Processor Test
  • Nanotechnology Test
  • On-line Test
  • Power Issues in Test
  • Reconfigurable System Test
  • Reliability
  • RF Test
  • Security and Trust Issues in Test
  • Self-Repair
  • Sensor Test
  • Signal Integrity Test
  • SiP, Stacked, 3D IC Test
  • SoC Test
  • Soft Errors
  • Standards in Test
  • Statistical Learning in Test
  • Test Compression
  • Test Quality
  • Test Synthesis
  • Thermal Issues in Test
  • Validation and Verification 
  • Variability Issues in Test
  • Yield Analysis and Enhancement 

Guidelines for Authors

Prospective authors are invited to submit novel, unpublished, and complete research contributions. Each submitted scientific paper should be a complete PDF manuscript, up to six (6) pages (inclusive of all figures, tables, and bibliography) in a standard IEEE format. The IEEE template can be found here. Papers not compliant with the IEEE template or exceeding the page limit will be returned without review.

A submitted scientific paper can be accepted for oral presentation or for poster presentation.

ETS fully complies with the IEEE publication policies regarding double submissions, plagiarism, etc. Authors unfamiliar with the IEEE official rules regarding double submissions and IEEE ethics are advised to read the Publication Guidelines section of the IEEE PSPB Operations Manual that can be found here.

A submission of a scientific paper is considered a commitment that, upon acceptance, authors will submit their camera-ready version for inclusion in the formal Proceedings and will present the paper (or the poster) at the symposium. Each accepted contribution must have at least one full paid registration by the time the camera ready paper is submitted for inclusion in the proceedings. ETS reserves the right to remove from IEEE Xplore papers and posters not presented at the symposium.

Key Dates

Submission of title, abstract, authors: December 5, December 13, 2016
Full Submission: December 13, 2016
Notification of acceptance: February 10, 2017
Camera-ready manuscript: March 17, 2017

Submission Website

Submissions should be made electronically as a single PDF file here.


ETS'17 will produce electronic formal Proceedings including all scientific papers, with ISBN number to be indexed in the IEEE Xplore Digital Library and other bibliographical search engines.

Scientific papers accepted for oral presentation require a final 6-page manuscript for inclusion in the formal Proceedings while scientific papers accepted for poster presentation require a final 2-page manuscript for inclusion in the formal Proceedings.

Best Paper Award

The Best Paper Award of ETS’17 will be presented at ETS’18.

Contact Information

For more information, please contact the Program Chair Haralampos-G. Stratigopoulos


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